1 METALLIZATION SPUTTERING PLASMA processes


Carlo Gennari   tel + 39 02 2552271   cell 335 8035324   carlo.gennari@fastwebnet.it        

KOLZER refurbished Vacuum Coating Plants

Vacuum coating processes : 

 

   Metallization   

Metallization allows to obtain bright or mat metal finishing, evaporating aluminum onto any substrates (glass, plastic, metal…) with a cold, dry and environmentally friendly cycle.

Mainly applications are reflectors (both automotive and solar applications), cosmetic and fashion accessories.

 

 

   Sputtering      

Using the technique of PVD Sputtering coating, which is a clean, dry and low cost process and takes place at room temperature, it’s possible to deposit any metal or alloy (chrome, stainless steel, brass, copper, titanium, pure silver…) on any material, shape, size and geometry substrate.

Coatings can fulfill the following purposes: aesthetic, functional, decorative, electronic, antibacterial, reflection, insulation, magnetism, filtration, conductivity, medical, wear, corrosion, mechanical and other.
ITO - Indium Tin Oxide - coated substrate.
Typical ITO applications : touch panel contacts, electrodes for LCD and electrochronic displays, energy conserving architectural windows, defogging aircraft and automobile windows, heat-reflecting coatings to increase light bulb efficiency, gas sensors, antistatic window coatings, wear resistant layers on glass, etc.

 

- Plasma etching:

is a clean, dry and cold  process that allows to:

- remove organic pollutants;
​- increase surface tension and therefore surface wettability;
​- form a surface which is able to react actively with the contact polymers (varnishes, adhesives, inks, etc).

It’s often combined with Metallization or Sputtering processes, in order to clean the substrate before the metal deposition and improve the adhesion of metal onto it.

VIDEO

- Plasma PECVD

- Plasma Enhanced Chemical Vapour Deposition:

PECVD allows to obtain anticorrosion transparent thin films on metals and alloys, and it is a “clean” technology that doesn’t require solvents, water, detergents, nor disposal systems, and uses very low quantities of reagents (for ex. Silicon compounds), making it economically attractive, too.

The technology consists in introducing all the elements in the process chamber, make them react and deposit on the substrate, which is “dipped” in a plasma environment . Internal characteristics of the material are not changed by this superficial deposit, but thanks to the plasma a very strong link will be created between the substrate and the film.

                                  Coating characteristics:

  • FILM FLEXIBILITY
  • STRONG ADHESION WITH THE SUBSTRATE
  • RESISTANCE TO IMPACTS
  • PROTECTION AGAINST CORROSION

 

  • GAS BARRIER
  • ANTI-SCRATCHING AND ANTI-WEARING
  • WATER REPELLENCY
  • TRANSPARENCY